Welcome to 北京赛车pk1052开奖网
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.
Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, computer peripherals, medical and network equipment.
求北京赛车pk10微信群： Custom specilized Assembly Package.
RF Module, SiP, MEMS,
CMOS Image Sensor,
High Power Module,
IGBT, MOSFET, HCPV,
(TM) & Thin Film Substrate" width="196" />
High Power LED, RF Communication,
HCPV, Automotive, Interposer
VCSEL, Crystal Package,
TE Cooler, Power Substrate